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Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration

Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration

Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration

Model number
SD823
MOQ
1pcs
Color
Blue
Package
64g/ set
Main characteristic
curing time is 5mins. Ratio is 10:1
Main application
metal, hard plastics, composite materials, glass, etc.
Lead time
within a week after payment
Price
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Quantity Needed:
Pieces
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Company Advantages
1. A quality audit will be carried out o SANDAO epoxy adhesive strictly. All textile fibers, chemical reagents or additives are carefully checked to ensure that any harmful chemicals are removed. It does not cause any corrosion to the material
2. Huizhou SANDAO New Material Co., Ltd will pays high attention to complaints of our Two-component epoxy structure bonding and take immediate measures to improve. It is an indispensable important insulating material for the electronics industry
3. Being tested by the advanced testing equipment, the product quality is assured. It is resistant to high temperature and low-temperature alternation
4. The competitive edges of the product are as follows: long service life, good performance, and exceptional quality. Its curing exothermic peak is low and the curing shrinkage is small
5. Thanks to its special epoxy adhesive and its high-tech resin glue, Two-component epoxy structure bonding adds high-end experience to any user. Without any halogen, it is healthy and environmentally friendly

our product

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Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration-1
Epoxy resin structural adhesive SD823
Epoxy resin structural adhesive SD823 is a kind of high strength acrylate structural adhesive, two-component 10:1, medium viscosity, fast curing (25 ℃, 5min), fast bonding and fixing, hard and toughness after curing, high adhesion strength and impact resistance. Anti-aging, good solvent resistance.

Feature

  • ◪   High strength, high performance, elastic, instantaneous, two components, safety and environmental protection

Application

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suitable for fast fastening and bonding of metal, hard plastics, composite materials, glass, etc., especially for mobile phone and notebook shell, screen and keyboard frame, suitable for high speed production line in electronic factory.

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Glass bonding

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Hard plastic bonding

Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration-4

Phone case bonding


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Composite bonding

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Metal bonding

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Notebook case bonding



product Performance

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1.Before curing
performanceComponent AComponent B
colorwhiteblue
specific gravity(25℃)1.051.14
Viscosity (25℃ m pa. s )85000-10000035000-50000
2.mixed characteristic
colorBlue 
ratioA:B=10:1 
Applicable time (mins)4 
3.After Curing characteristic
shear strength(N/mm.2)PC/Aluminum magnesium10.02
shear strength(N/mm.2)PC/PC6.71
Split / elongation % 150
Hardness(shore- D) 68
Working temperature(℃)-50-130

Remind:The above performance data are typical data measured in the temperature of 25 ℃, humidity of 70% of the laboratory environment, only for reference, we cannot guarantee all the data can achieve under a specific environment. Customers are kindly requested to use actual measure data in using.

Product details

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Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration-8
Epoxy resin structural adhesive
SD823 is a high strength acrylate structural adhesive with a two component 10:1 system.
Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration-9
Eco-environmental protection
odorless, non-pollution, safety and environmental protection, medium viscosity, fast curing .
Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration-10
Yellow/blue liquid
It has fast bonding and firmness. hard and tough after curing. high bonding strength and impact resistance, and good resistant to aging and solvent.
Two-component epoxy structure bonding potting factory price for Semiconductor refrigeration-11
AB mixing tube
packaging specifications: 64g /tube

Use instructions

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  • Put on AB glue gun and put on the thread mixing head.

  • The thickness of adhesive layer should be 0.05mm, the coated object should be clamped immediately, and the maximum bonding strength will be guaranteed by uniform contact pressure.

  • To obtain the highest mechanical strength, the surface of the material can be polished or sandblasted, and then the dust and oil stains on the surface can be scrubbed with a special solvent.

  • Adhesive should be put on both sides of the object and fix the splice in avoid of dislocation. Do not mix the lid of A and B to prevent contamination of the gum.

Caution

  • 1.   AB adhesive is slightly irritating, please wear gas mask and anticorrosion gloves when operating.

  • 2.   Cover at any time after each extraction, lest moisture absorption affect curing and performance.

  • 3.   Mass use of this product needs to be in a well-ventilated place.


Packaging and preservation

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AB glue is packed with AB mixed pipe, 64g/ pcs, transported as non-dangerous goods, should be stored in a dry, shady place (below 5 ℃ ~ 26 ℃), the shelf life is within 12 months from the date of manufacture.


Company Features
1. Our manufacturing plant is equipped with production facilities. These facilities ensure our workers to finish their tasks in an efficient manner, enabling them to meet customers' requirements quickly and flexibly.
2. Huizhou SANDAO New Material Co., Ltd aims to help clients achieve their values ​​and dreams. Please contact us!
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