SANDAO  > 

AI - Page Sitemap

 > 

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts

Model number
SD6341
MOQ
1pcs
Color
White/black liquid
Package
1.25kg/ set
Main characteristic
Two-component Ratio is 4:1, no need of vacuum defoaming
Main application
silicon steel materials, roller core materials, coil windings,etc.
Lead time
within a week after payment
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts
Product Details
SANDAO New Material's silicone rubber is exquisite in details.Under the guidance of market, SANDAO New Material constantly strives for innovation. silicone rubber has reliable quality, stable performance, good design, and great practicality.
Application Scope
The silicone rubber developed by SANDAO New Material is widely used in Manufacturing Chemicals Other Chemicals industry.With a focus on customers' potential needs, SANDAO New Material has the ability to provide one-stop solutions.
Company Advantages
1. SANDAO ge rtv silicone is fabricated using optimum quality raw materials and pioneering technology.
2. The product has the advantage of stability. Its contoured shape effectively helps support the feet in two directions, both lengthwise and across the arch.
3. The market prospect of the product is positive with increasing demand in the global base.
4. As the demand for global bases increases, the market prospects for this product are optimistic.

our product

bg


SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-1
Epoxy resin potting sealant SD6341
Epoxy resin potting sealant SD6341 is a two-component electronic material used for general electronic component sealing and circuit board sealing. It can be cured at room temperature or heated, and the cost is lower. Temperature during curing is low and the highest exothermic temperature is less than 50 ℃. Good surface gloss, low shrinkage, excellent moisture resistance and insulation after curing.

Application

bg


Epoxy resin pouring sealant is widely used in silicon steel materials, roller core materials, coil windings, capacitor bushing and other important radiating and high temperature resistance electronic appliances, such as transformers, motors, radiators, sensors, electromagnets, PCB plates, solenoid valves, air conditioners, power module, electromagnetic clutch, automobile parts, etc.

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-2

air conditioning

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-3

heat sink

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-4

Induction cooker bonding


SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-5

PCB board bonding

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-6

Power module

SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-7

Motor bonding



product Performance

bg


Characteristics
  • ◪  Two-component 4:1 ratio, 100% solidification, no solvent, no pollution, no toxicity.

  • ◪  Good weather resistance, water resistance, oil resistance, acid resistance, high temperature resistance, insulation, flame retardant, cracking resistance and so on.

  • ◪  Can be cured at room temperature and heating, high bonding strength. Stable performance, good toughness and filling after curing, excellent physical, mechanical and insulation properties.

  •   It has low viscosity after mixing, no need of vacuum defoaming at room temperature, and long operating time, so it’s a kind of ideal pouring glue.

  •   For some larger parts of the pouring and sealing, can be one-time molding, more operational advantages.

  •   Achieve actually measured high thermal conductivity: 0.8w/m.k

General performance
ItemConditionPart APart BMix liquid
AppearanceVisualWhite/black Viscous liquidTransparent / brown liquidWhite/black liquid
Density25℃,g/cm31.64~1.651.11~1.131.59~1.61
Viscosity25℃, mpa.s12000~1300040~120800~1000

Usage: 1.Mixing: mix part A and part B at 4:1 ratio by weight, potting after stir well. The operating time after mixing is 60 minutes at 25 ℃.
2.Solidification: at 25 ℃, it will harden at 6 for 8 hours, and at 80 ℃ for 1 hour. It can be assembled after hardening. Tests typically take place after 24 hours of curing.

Notes:This data is measured by the technicians in the laboratory, which has certain reference value for the users. However, because the usage methods and conditions of each user are different, it is suggested that the users should find out the best technology and method according to their own conditions.


Feature after curing
Itemcondition/unitTest result
HardnessShore-D>80
Volume resistivity25℃,Ω.cm2.8*1015
Breakdown voltage25℃,kv/mm>30
Dielectric constant25℃,1MHZ3.1±0.1
Dielectric loss tangent25℃,1MHZ<0.01
Shear temperature rangeMpa>10
Operating temperature range-40~150
Curing shrinkage%<0.5

Attention: 1, This kind of products are not dangerous goods, according to the general chemical storage and transportation, the storage period is 1 year.
2, A component should be stirred properly before use (as there will be precipitation after long period of time, it does not affect the performance after stir well,); after accurate weighing of component A and component B, please stir well and then use it.
3, The mixing amount of glue should not be too large, otherwise, the operating time will be shortened which lead to waste if cannot use out timely.

Notes:The above performance data are typical data of the product at humidity 70 ℃, temperature 25 ℃,for customer's reference only. Customers are kindly requested to use the measured data.

Product details

bg
SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-8
Epoxy resin potting and sealing adhesive
SD6341 epoxy potting compound is a two-component electronic material used for Potting of general electronic components And circuit board sealing.
SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-9
White/black viscous liquid
It can be cured at room temperature, and can be Cured by heating. After curing, the surface gloss Is good, the shrinkage rate is low, and the Moisture resistance and insulation Performance are excellent.
SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-10
Green environmental protection
Non-toxic, non-corrosive, free of harmful Substances.
SANDAO silicon Two-component addition-type potting adhesive TDS widely-use for glass parts-11
Plastic bottle packaging
packaging specifications: 1.25kg/ set.

Company Features
1. With a team of high-quality professionals, Huizhou SANDAO New Material Co., Ltd R&D ability for Two-component addition-type potting adhesive TDS is in the front rank in China.
2. Equipped with technicians, SANDAO is more confident to produce high quality Two-component addition-type potting adhesive TDS.
3. The source of keeping SANDAO ahead of other companies is to always hold the idea of customer first. Call! Huizhou SANDAO New Material Co., Ltd always worked hard to provide quality services. Call! Exquisite products, perfect service and preferential prices are the business objectives of SANDAO New Material. Call! Huizhou SANDAO New Material Co., Ltd will consistently provide high quality Two-component addition-type potting adhesive TDS. Call!
Product Message
Chat Online 编辑模式下无法使用
Chat Online inputting...