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Sandao heat conductive silicone grease is widely used in heat dissipation, filling or coating of electronic, electrical and component to derive the heat generated by components. Such as CPU and radiator gap, high-power transistor, thyristor elements, diode and substrate (aluminum, copper) contact gap filling. It can used between the power amplifier and radiator, semiconductor refrigeration to reduce the working temperature of the heating element.
Coffee pot
High power triode
Induction cooker
Power module
Thyristor component
Oven gap filling
| Item | Test data |
| Appearance | White paste |
| Penetration degree（1/10mm，25℃） | 260～300 |
| Specific gravity（g/cm3） | 1.9～2.1 |
| Bleed（%。200℃，8h） | ≤2.0 |
| Fugitive constituent（%。200℃，8h） | ≤2.0 |
| Break down strength（kv/mm） | ≥10 |
| Volume resistivity（Ω.cm） | 4×1014 |
| Thermal conductivity（w/m·k） | ≥0.8 |
clean the surface, remove the grease, then extrude the thermal conductive silicon grease directly.
The uniform coating should be applied to the surface.
The coating can be brushed, scraped or rolled as needed.
The coating surface should be uniform, coating more isn’t mean the better, but in the premise of filling the surface gap, coating a thin layer is enough.
Packing specification: 1.0kg/ can, 100g/pcs, negotiable to according to the user's needs.
Storage: store in a cool and dry place for one year.
Note: The above data are based on our extensive experiments and the results are reliable. However, due to the diversity of practical applications, the application conditions are not within our control, so users need to conduct tests before using to confirm whether this product is applicable or not. We do not warrant any problems arising from the use of our products under specified conditions and are not liable for any direct, indirect or accidental loss. If any problems in usage, you can contact our technical services department, we will do what we can to help you.
Copyright © 2019 Huizhou Sandao New material Co., Ltd. | All Rights Reserved
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