SD838 all-purpose nail-free adhesive
SD838 all-purpose nail-free adhesive is a new type of modified silane sealant with low modulus and high elasticity, which is mainly aimed at solve the problems of joint shrinkage deformation, poor weathering resistance of sealant and poor adhesion between sealant and substrate. The product has excellent mechanical properties, strong resistance to shift, excellent weather resistance, no substrate pollution, non-toxic low VOC, non-corrosive mirror, and have excellent adhesive properties with concrete, stone, ceramics and glass and other substrates and so on.
Multifunctional adhesives can be used for bonding, sealing and repairing cracks.
High-strength bonding force suitable for different substrates: concrete walls, wood panels, ceramic products, metals, stone and so on. It can be used on wet surface.
baseboard clearance
glass bonding
stone bonding
wall drill bonding
wall gap bonding
window gap bonding
Type | SD838 |
Color | yellow |
Viscosity (pa.s) 10rpm | 900 |
Initial curing time(mins) | 30 |
100% modulus (Mpa) | 1.2 |
Elongation at break(N/mm) | 230 |
Tensile strength(MPa) | 1.5 |
The product has excellent mechanical properties, strong resistance to shift, excellent weather resistance.
The construction surface should be clean and dry. Cover the adjacent surfaces of the glueing with striped rubber paper. Stab aluminum film, cut the tip into 45 degrees, glueing evenly. Use a scraper or latex glove to smooth the glue. Tear off the striped tape before the glue curing. If glue is not used up, natural seal by extruding 1cm rubber wire, and remove the solidified part before next use .
1. Not suitable for: adhesion of smooth surface substrates.
2. Maximum endurance curing time: 24 hours.
3. Construction environment temperature: 5 ℃ ~ 40 ℃.
4. The operating temperature shall not be lower than-20 ℃ or above 65 ℃.
5. Store in a cool and dry place under normal temperature, storage period is 12 months.
urea formaldehyde resin
1. Application Field
TIONES UF & MUF Resin Powder is suitable for the processing of plywood, particle board,
MDF&HDF and the other wood processing. Below are mainly applications for reference:
a).Various kind of wood composite boards
b)Gluing Plywood & Bentwood
c)Surface veneer for furniture and decorative boards
d).Engineered solid wood flooring
2. Application Details for Plywood Production:
1. Pretreatment for gluing wood material:
a)Moisture Content reach to 10 + 2%
b)Remove Knots, Cracks, oil stain and resin etc.
c)Wood surface must be flat and smooth. (Thickness Tolerance<0.1mm)
2. Mixture of Glue
a)Mixture Ratio(weight):
composition | Dosage(PBM) |
UF resin | 100 |
water | 70 |
Wheat flour | 30 |
urea | 2 |
Hardener | 1.5-2 |
b)Dissolution Method:
Put 2/3 of the total needed water into mixer first, and then add above needed items.
Switch on the mixer with speed of 50~150 rotations / minute, after glue powder
being completely dissolved, put the remained 1/3 water in mixer and churn for
3~5minutes until the glue solution is completely mixed together again.
c)The user could add hardener into the mixed liquid glue according to actual
requirement, and control the active period of dissolved liquid glue.
3. Pot life
Once liquid glue completely mixed, the curing reaction starts. Whatever, the pot life
depends on glue temperature.
Temperature | 20°C | 25°C | 30°C |
Pot life,hours | 5~7 | 3~5 | 1-3 |
4. Specifications
Urea formaldehyde resin | ||
item Specification Result | ||
Appearance | White powder |
|
Viscosity 25°C | 3000-4500CPS | 4000CPS |
Content | ≥98% | 99% |
formaldehyde emission | ≤3 | 2.9 |
volatile substance | <2 | 1.9 |
Moisture content | ≤2 | 1.8 |
PH | 7.5-8.0 | 7.6 |
specific gravity 25°C | 1.220 | 1.1 |
mesh size | 80-120 Mesh | 10 0 |
5.photo:
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