The most important application is to replace the thermal grease (paste) for the filling and bonding between the CPU and the heat sink, the thyristor intelligent control module and the heat sink, the high-power electrical module and the heat sink.
|Tensile strength (MPa)||≥2.5||≥2.5||≥2.5|
|Hardness (shore A)||50～65||50～65||50～65|
Cleaning the surface of the adhered or coated object to remove rust, dust and oil.
Unscrew the rubber cap and squeeze the glue onto the cleaned surface to make it evenly distributed.
Place the glued or sealed parts in the air to allow them to cure naturally. The curing process is a curing process from the surface to the inside. The glue will cure to a depth of 2-4 mm within 24 hours (room temperature and 55% relative humidity). If the position is deep, especially in areas where air is not easily accessible, The time to complete cure will be extended, and if the temperature is lower, the cure time will also be extended.
1. Keep thermal paste out of reach of children.
2. Manufacturer shall not be liable to the buyer or any third party for injury, loss or damage directly or indirectly resulting from the use of, or inability to use, the product. Recommendations or statements other than those contained in a written agreement signed by an officer of the manufacturer shall not be binding by the manufacturer. This product has not been tested for, and is therefore not recommended for, uses for which prolonged contact with mucous membranes, abraded skin, or blood is intended; or for uses which implantation within the human body is intended.
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