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Sandao high temperature resistant epoxy resin AB adhesive SD829 is used for bonding metals, plastics, rubber, glass, electroplating / baking paint / magnetic materials, such as for aircraft, motor, etc.
Electroplating paint bonding
Glass bonding
Motor parts bonding
Metal bonding
Plastic bonding
Rubber bonding
Rubber bonding
| Epoxy resin AB glue | SD829 part A | SD829 Part B | ||
| Appearance /color | milky | black | ||
| Viscosity (mPa.s 25℃) | 26000-28000 | 26000-28000 | ||
| Specific gravity (g/ml 25℃) | 1.6-1.9 | 1.6-1.9 | ||
| Ratio（weight ratio pbw） | 1 | 1 | ||
| Gel time under normal temperature（25℃）20g | 1h | |||
| Curing condition | 80℃ | 30 mins | ||
| Temperature range（℃） | -30℃-180℃ | |||
| Hardness（shore-D） | 85/100 | |||
| Epoxide equivalent（g/eq） | 185/190 | / | ||
| Active hydrogen equivalentg/eq | / | 185/195 | ||
| Distortion temperature HDT | 80℃ | |||
| Distortion temperature HDT | 5.0~1015 | |||
| Surface resistivity（Ω.cm）25℃ | 4.0×1015 | |||
| Shear strength of different materials（Mpa） | ||||
| Aluminum / copper | 17-20 | |||
| Steel | 18/23 | |||
| ABS | 7-8 | |||
1. AB glue is slightly irritating, please wear gas mask and anticorrosion gloves when operating.
2. Cover at any time after each extraction, lest moisture absorption affect curing and performance.
3. Mass use of this product needs to be in a well-ventilated place.
AB glue is packed with AB mixed pipe, 64g/ pcs, transported as non-dangerous goods. It should be stored in a dry, shady place (below 5 ℃ ~ 26 ℃), the shelf life is within 12 months from the date of manufacture.
HBC-2830 Epoxy potting resin
I. The features and typical using:
Item | usage | performance |
2830 Typical | Used in the potting sealing for the general electronic components and protecting sealing for the circuit boards At room temperature. | In the normal atmospheric temperature it can be solidified, and when solidifying, the exthothermal temperature is low. the shrinking rate is low. the solidified surface is bright, no cracking, moisture-proof, water-resistant insulation, no corrosion-resistant chemicals. |
II. Using methods:
item | 2830 |
proportion of mixture(weight ratio) | 10:2.5 That is 4:1 |
Using time (100g,hr ,25 C) | 1 |
Solidified condition | Under 25 C, within |
1, Matches the rubber: grouping the Liquid cement component after full agitation in the original package, according to the proportion of mixture, divide into group A and group B. (according to mixture ratio refer to table), after agitation even, and then carries on sealing. After mixing, and then make using the rubber, details, please see above table. After surpassing the using time, the liquid cement viscosity will be very high, no longer suitable for infusion. should not be too much of, otherwise they will be wastage
2,Curing: please See curing conditions on the table. Relate to the Curing speed and temperature. Higher temperature, faster curing. In the winter, with the low temperatures, the curing time will be extended. all kinds of rubber can be used curing temperature, under 60 C can be curing in two to three hours. After the glue hardens, then can be assembly, testing generally require the curing time within 24 to 48 hours.
III. Fore-and-aft solidification technical parameter
Testing item | 2830 | ||
Fore solidifying | appearance visual estimation | liquid cement A | Black viscous fluid |
Glue B | Brown viscous fluid | ||
densityg/cm3
| Glue A | 2.01--2.05 | |
Glue B | 1.10--1.13 | ||
Viscosity cps
| adhesive solution A | 15000-- 35000 | |
adhesive solution B | 40--120 | ||
Aft solidifying | hardness(Shore-D) | >80 | |
Volume Resistance (Ω.cm ) | 2.8*1015 | ||
breakdown voltage (kV/mm 25s | >30 | ||
dielectric constant (1.2MHz 25℃） | 3.1±0.1 | ||
dielectric dissipation factor (1.2MHz） | <0.01 | ||
Dimensional shrinkage constraint (%) | <0.4 | ||
shear strength（Fe-Fe,MPa） | >10 | ||
| Temperature (℃） | -60--- 150 | ||
thermal conductivity [W/m.k 25℃ ] | 0.6 | ||
IV. Notices
1.pre-use, Part A the compound materials must certainly be stirred evenly in the original package (because of long-term precipitation, it may have deposition, stirring even then can be used, does not affect performance)
2.As the temperature changes in different seasons the products have different curing rate. This situation is normal. In winter, temperature is low, and curing will be getting slower. These Above glues can be used with heating curing methods.
3.Some glues, group A and group B possibly presents the crystallization and agglomeration under the low temperature condition. this is normal; Before using, you can put in 80℃ in the drying oven to cause its melting, is you want to use, you could put in the room temperature and then use. this does not affect its each performance.
V. Packaging specification:
2830 |
25Kg/set ,6.5 Kg/set Pack in Drums |
VI. Color: white, black.
VII. Storing and transportation:
1.Each product's storage time is 1 year
2.This kind of product is the non-dangerous material, can be delivered according to the non-dangerous material in the transportation
1) Suitable for adhesive, PVC film, plastic, glass, metal trademark surface glue and the surface of phone case.
2) Especially suitable for the epoxy of magnetic stick, mobile post, tattoo paste, wine mark.
3) Applied for electronic components such as LED perforation lamp, crystal handicraft’s transparent packaging.
AB glue use for pendant
AB glue use for sticky
AB glue use for logo
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