|Epoxy resin AB glue||SD829 part A||SD829 Part B|
|Viscosity (mPa.s 25℃)||26000-28000||26000-28000|
|Specific gravity (g/ml 25℃)||1.6-1.9||1.6-1.9|
|Ratio（weight ratio pbw）||1||1|
|Gel time under normal temperature（25℃）20g||1h|
|Curing condition||80℃||30 mins|
|Active hydrogen equivalentg/eq||/||185/195|
|Distortion temperature HDT||80℃|
|Distortion temperature HDT||5.0~1015|
|Shear strength of different materials（Mpa）|
|Aluminum / copper||17-20|
AB glue is packed with AB mixed pipe, 64g/ pcs, transported as non-dangerous goods. It should be stored in a dry, shady place (below 5 ℃ ~ 26 ℃), the shelf life is within 12 months from the date of manufacture.
HBC-2830 Epoxy potting resin
I. The features and typical using:
Used in the potting sealing for the general electronic components and protecting sealing for the circuit boards At room temperature.
In the normal atmospheric temperature it can be solidified, and when solidifying, the exthothermal temperature is low. the shrinking rate is low. the solidified surface is bright, no cracking, moisture-proof, water-resistant insulation, no corrosion-resistant chemicals.
II. Using methods:
proportion of mixture(weight ratio)
10:2.5 That is 4:1
(100g,hr ,25 C)
Under 25 C, within
1, Matches the rubber: grouping the Liquid cement component after full agitation in the original package, according to the proportion of mixture, divide into group A and group B. (according to mixture ratio refer to table), after agitation even, and then carries on sealing. After mixing, and then make using the rubber, details, please see above table. After surpassing the using time, the liquid cement viscosity will be very high, no longer suitable for infusion. should not be too much of, otherwise they will be wastage
2,Curing: please See curing conditions on the table. Relate to the Curing speed and temperature. Higher temperature, faster curing. In the winter, with the low temperatures, the curing time will be extended. all kinds of rubber can be used curing temperature, under 60 C can be curing in two to three hours. After the glue hardens, then can be assembly, testing generally require the curing time within 24 to 48 hours.
III. Fore-and-aft solidification technical parameter
liquid cement A
Black viscous fluid
Brown viscous fluid
adhesive solution A
adhesive solution B
Volume Resistance (Ω.cm )
breakdown voltage (kV/mm 25s
dielectric constant (1.2MHz 25℃）
dielectric dissipation factor (1.2MHz）
Dimensional shrinkage constraint (%)
[W/m.k 25℃ ]
1.pre-use, Part A the compound materials must certainly be stirred evenly in the original package (because of long-term precipitation, it may have deposition, stirring even then can be used, does not affect performance)
2.As the temperature changes in different seasons the products have different curing rate. This situation is normal. In winter, temperature is low, and curing will be getting slower. These Above glues can be used with heating curing methods.
3.Some glues, group A and group B possibly presents the crystallization and agglomeration under the low temperature condition. this is normal; Before using, you can put in 80℃ in the drying oven to cause its melting, is you want to use, you could put in the room temperature and then use. this does not affect its each performance.
V. Packaging specification:
25Kg/set ,6.5 Kg/set Pack in Drums
VI. Color: white, black.
VII. Storing and transportation:
1.Each product's storage time is 1 year
2.This kind of product is the non-dangerous material, can be delivered according to the non-dangerous material in the transportation
Hello, please leave your name and email here before chat online so that we won't miss your message and contact you smoothly.