Reasonable uv bonding glue metal buy now for electronic products

1. Types and characteristics of polymer matrix materials The higher thermal conductivity of matrix materials, the better the dispersion of filler in matrix, the better the combination of matrix and filler, and the better thermal conductivity of thermal composites.2. Type of filler The higher thermal conductivity of the filler, the better thermal conductivity of the composites.3. Shape of filler the sequence of thermal conduction pathways are  fibrous , flake and granular, the easier the filler is to form thermal conduction pathways, the better thermal conductivity.4. Content of fillerThe distribution of filler in polymer determines the thermal conductivity of composite. When the content of filler is small, the effect of heat conduction is not obvious. When there is too much filler, the mechanical properties of the composites will be greatly affected. When the content of the filler increases to a certain value, the interaction between the filler forms a network or chain chain in the system. When the direction of the chain is consistent with the direction of heat flow, the thermal conductivity is best. Therefore, there is a critical value of the quantity of heat conducting filler.5. Bonding characteristics of filler and matrix material interface .The higher the degree of binding between the filler and matrix, the better the thermal conductivity. The suitable coupling agent is used for surface treatment of the filler, and the thermal conductivity can be increased by 10%-20%.

First,it’s very easy to remove and clean when the silicone rubber uncured. No matter it’s in human body, utensils or clothing,just wash it by water. Second,it’s very difficult to remove organic silica gel after curing, If solidified gel is cohere to glass, ceramics, metals and so on, you can clean it with solvents such as xylene and acetone. If you don't know these two kinds of substances. Banana water can be considered, because banana water contains these two kinds of substances, If there is less organic glue attached to objects such as glass, you can also try scraping it off with a scraper. If cohere to cloth, try to use brush, if not ok, choose banana water.   Third, it is easy to deal with if silicone rubber cohere on hands. Organic silicone will not stick to the hand after cured, so we can remove it by rub hands. 

During the filling process, the problem of bubbles in the capacitor after filling is often encountered, which may be due to the following reasons:1. Bubbles come when mixing and pottingIt is very easy to bring air into the glue because of the large viscosity of glue or wrong stirring. If the viscosity of glue is large, the bubble is difficult to eliminate. If the glue viscosity is small, the glue solidifies slowly, the bubble will slowly float to the surface to eliminate automatically. In order to eliminate the bubbles in the process of glue filling, the bubbles can be eliminated by vacuuming, heating to reduce viscosity, adding diluent to reduce viscosity or adding defoamer. Pls choose the best way for yourself.  2. Bubbles come during curingThere are also several reasons for the formation of bubbles in the curing process: the curing speed is too fast, the exothermic temperature is high, the shrinkage of the glue is large, too much plasticizer and solvent in the glue.these are easy to produce bubbles in the curing process. Epoxy resin sealant is widely used in electronic products such as transformers, capacitors and so on. Its main functions are moisture-proof, water-proof, oil-proof and dust-proof. It also has excellent resistance to moisture, heat and aging. By virtue of these advantages, it occupies a considerable advantage in the field of electronic encapsulation.

As heat conducting material, silica gel can quickly absorb heat and give off heat.The higher the thermal conductivity of the silicone is, the more effective it is in transmitting heat from your processor to the radiator.Thus reducing the technical difference between the radiators and the radiating structure components which requires the effect of shock absorption, installation, testing, and the convenience of repeated use.