reasonable ab glue structural at discount for coffee pot gap filling

Product Information of reasonable ab glue structural at discount for coffee pot gap filling

Enterprise Strength

SANDAO New Material's initial intention is to provide service that can bring customers comfortable and secure experience.

Product Comparison

ms adhesive has the following advantages: well-chosen materials, reasonable design, stable performance, excellent quality, and affordable price. Such a product is up to the market demand. ms adhesive is more competitive than other products in the same category, as shown in the following aspects.

Company Advantages
1. SANDAO resin glue has gone through some important production stages. They cover the preparation of raw materials, parts machining, plating and anodizing, assembly, and testing.
2. The product features an easy operation. It has a relatively simple operating system combining a powerful processing flow and provides simple operation instruction.
3. The product has the advantage of stable mechanical properties. Having been treated under extremely cold temperatures, its mechanical components are tensile enough to withstand extreme industrial conditions.
4. Huizhou SANDAO New Material Co., Ltd comply with stringent requirements which make its ab glue much more resin glue.
5. Huizhou SANDAO New Material Co., Ltd's sales network has spread all over the country and has occupied a wide share in ab glue market.

our product

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Sandao High temperature resistant epoxy resin AB adhesive SD829

Sandao High temperature resistant epoxy resin AB adhesive SD829 is a two component high temperature resistant adhesive based on epoxy resin. It has high shear peeling strength, good toughness, waterproofing, corrosion resistance ,weak acid and alkali resistance, impact resistance, low smell, resistance to most chemical media, Extreme temperature and excellent electrical insulation. Self-leveling, suitable for filling, bonding and sealing.

Application

Sandao high temperature resistant epoxy resin AB adhesive SD829 is used for bonding metals, plastics, rubber, glass, electroplating / baking paint / magnetic materials, such as for aircraft, motor, etc.

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Electroplating paint bonding

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Glass bonding

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Motor parts bonding

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Metal bonding

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Plastic bonding

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Rubber bonding

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Rubber bonding

product Performance

Epoxy resin AB glue		SD829 part A	SD829 Part B
Appearance /color		milky	black
Viscosity (mPa.s 25℃)		26000-28000	26000-28000
Specific gravity (g/ml 25℃)		1.6-1.9	1.6-1.9
Ratio（weight ratio pbw）		1	1
Gel time under normal temperature（25℃）20g		1h
Curing condition	80℃	30 mins
Temperature range（℃）		-30℃-180℃
Hardness（shore-D）		85/100
Epoxide equivalent（g/eq）		185/190		/
Active hydrogen equivalentg/eq		/		185/195
Distortion temperature HDT		80℃
Distortion temperature HDT		5.0~10¹⁵
Surface resistivity（Ω.cm）25℃		4.0×10¹⁵
Shear strength of different materials（Mpa）
Aluminum / copper		17-20
Steel		18/23
ABS		7-8

Product details

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High temperature epoxy resin AB glue

SD829 high temperature resistant epoxy resin AB glue is an epoxy resin based two component high temperature adhesive.

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Milky /black

It's high shear strength, good toughness, waterproof, non-corrosive and other weak acid and alkali resistance, extreme temperature and excellent electrical insulativity properties.

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Eco-environmental protection

Odorless, non-pollution, anti-shock, resistant to most chemical media.

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AB mixing tube

packaging specifications: 64g /tube.

Use instructions

Caution

1. AB glue is slightly irritating, please wear gas mask and anticorrosion gloves when operating.
2. Cover at any time after each extraction, lest moisture absorption affect curing and performance.
3. Mass use of this product needs to be in a well-ventilated place.

Packaging and preservation

AB glue is packed with AB mixed pipe, 64g/ pcs, transported as non-dangerous goods. It should be stored in a dry, shady place (below 5 ℃ ~ 26 ℃), the shelf life is within 12 months from the date of manufacture.

Company Features
1. With a vast amount of experience in designing and manufacturing resin glue, Huizhou SANDAO New Material Co., Ltd has been one of the most competitive manufacturers and suppliers.
2. We have a team of designers. They are highly qualified and experienced. They are responsible for understanding the design needs of our customers by keeping track of the latest technology trends.
3. Our mission is to establish strong relationships with all our partners and to ensure client satisfaction by the highest quality products. Sustainable development is at the core of our daily operations and guides our future progress. We believe we will benefit from these efforts in a number of ways. We don't strive to be the largest seller in the industry. Our goals are simple: to sell the best products at the lowest cost and provide industry-leading customer service.

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Relevant Articles

Five important factors affecting thermal conductivity of silicone grease

1. Types and characteristics of polymer matrix materials The higher thermal conductivity of matrix materials, the better the dispersion of filler in matrix, the better the combination of matrix and filler, and the better thermal conductivity of thermal composites.2. Type of filler The higher thermal conductivity of the filler, the better thermal conductivity of the composites.3. Shape of filler the sequence of thermal conduction pathways are fibrous , flake and granular, the easier the filler is to form thermal conduction pathways, the better thermal conductivity.4. Content of fillerThe distribution of filler in polymer determines the thermal conductivity of composite. When the content of filler is small, the effect of heat conduction is not obvious. When there is too much filler, the mechanical properties of the composites will be greatly affected. When the content of the filler increases to a certain value, the interaction between the filler forms a network or chain chain in the system. When the direction of the chain is consistent with the direction of heat flow, the thermal conductivity is best. Therefore, there is a critical value of the quantity of heat conducting filler.5. Bonding characteristics of filler and matrix material interface .The higher the degree of binding between the filler and matrix, the better the thermal conductivity. The suitable coupling agent is used for surface treatment of the filler, and the thermal conductivity can be increased by 10%-20%.

How to remove organic silica gel ?

First,it’s very easy to remove and clean when the silicone rubber uncured. No matter it’s in human body, utensils or clothing,just wash it by water. Second,it’s very difficult to remove organic silica gel after curing, If solidified gel is cohere to glass, ceramics, metals and so on, you can clean it with solvents such as xylene and acetone. If you don't know these two kinds of substances. Banana water can be considered, because banana water contains these two kinds of substances, If there is less organic glue attached to objects such as glass, you can also try scraping it off with a scraper. If cohere to cloth, try to use brush, if not ok, choose banana water. Third, it is easy to deal with if silicone rubber cohere on hands. Organic silicone will not stick to the hand after cured, so we can remove it by rub hands.

Solution to bubbles in epoxy resin potting compound

During the filling process, the problem of bubbles in the capacitor after filling is often encountered, which may be due to the following reasons:1. Bubbles come when mixing and pottingIt is very easy to bring air into the glue because of the large viscosity of glue or wrong stirring. If the viscosity of glue is large, the bubble is difficult to eliminate. If the glue viscosity is small, the glue solidifies slowly, the bubble will slowly float to the surface to eliminate automatically. In order to eliminate the bubbles in the process of glue filling, the bubbles can be eliminated by vacuuming, heating to reduce viscosity, adding diluent to reduce viscosity or adding defoamer. Pls choose the best way for yourself. 2. Bubbles come during curingThere are also several reasons for the formation of bubbles in the curing process: the curing speed is too fast, the exothermic temperature is high, the shrinkage of the glue is large, too much plasticizer and solvent in the glue.these are easy to produce bubbles in the curing process. Epoxy resin sealant is widely used in electronic products such as transformers, capacitors and so on. Its main functions are moisture-proof, water-proof, oil-proof and dust-proof. It also has excellent resistance to moisture, heat and aging. By virtue of these advantages, it occupies a considerable advantage in the field of electronic encapsulation.

High heat conductively grease features

As heat conducting material, silica gel can quickly absorb heat and give off heat.The higher the thermal conductivity of the silicone is, the more effective it is in transmitting heat from your processor to the radiator.Thus reducing the technical difference between the radiators and the radiating structure components which requires the effect of shock absorption, installation, testing, and the convenience of repeated use.

Reasonable ab glue structural at discount for coffee pot gap filling

our product

Application

product Performance

Product details

Use instructions

Caution

Packaging and preservation