ge rtv silicone | Two-component addition-type potting adhesive TDS

Product Information of organic silicon electronic potting sealant SD9501

Product Comparison

Under the guidance of market, SANDAO New Material constantly strives for innovation. silicone rubber has reliable quality, stable performance, good design, and great practicality.Compared with similar products, SANDAO New Material's silicone rubber has the following advantages.

Product Details

SANDAO New Material pursues perfection in every detail of ms adhesive, so as to show quality excellence.SANDAO New Material has the ability to meet different needs. ms adhesive is available in multiple types and specifications. The quality is reliable and the price is reasonable.

Company Advantages
1. SANDAO Two-component addition-type potting adhesive TDS is manufactured using state-of-the-art technology to strictly meet with the set industry standards.
2. The product is not prone to corrosion. It won't corrode when exposed to damaging chemicals, saline, grease, moisture, or heat for prolonged periods of time.
3. The product is in high demand at home and abroad thanks to its considerable economic benefits.

our product

organic silicon electronic potting sealant SD9501-1

Sandao organic silicon electronic potting sealant SD9501

Sandao organic silicon electronic potting sealant SD9501 is synthesis organo silicon electronic pouring sealant with high elasticity and high transparent for electronic component, packing divided to A and B two component, mixes the A and B two components and fully agitates before filling and sealing; The mixture has good fluidity, good elasticity after curing, excellent resistance to high and low temperature, excellent electrical performance, ozone resistance and atmospheric aging resistance, which is used for long-term outdoor use. The products are in full compliance with the requirements of the EU RoHS Directive.

Feature

◪ Resistance to high and low temperature -60~260℃
◪ Sandao organic silicon electronic pouring sealant with the advantages of automatic leveling, automatic remove air bubbles, high viscosity, high temperature resistance, moisture proof and waterproof insulation, easy rework, it can used as adhesive, sealing, waterproof, moisture-proof, mildew proof, dustproof, filling seal, shock absorption, aging resistance and so on.

Application

This potting sealant is fit for electrical and electronic components which required for waterproof and insulation, used for adhesive and sealing LED junction box, wind power motor, PCB substrate, etc., as well as various AC/DC power supply modules, control modules, automotive HID stabilizers, lights and various power control modules,etc.

organic silicon electronic potting sealant SD9501-2

DC power module bonding

organic silicon electronic potting sealant SD9501-3

LED junction box bonding

organic silicon electronic potting sealant SD9501-4

Wind energy motor bonding

organic silicon electronic potting sealant SD9501-5

Power module

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PCB board bonding

organic silicon electronic potting sealant SD9501-7

Lamp part Bonding

product Performance

No.	Item			Standard	Standard	Standard
1	Before curing	Part A	appearance	transparent	black	white
2			viscosity(m Pa·S)	800～1000	800～1000	800～1000
3			density(g/cm3)	0.95～1.0	0.95～1.0	0.95～1.0
4		Part B	appearance	transparent	transparent	transparent
5			viscosity (m Pa·S)	50-150	50-150	50-150
6			density (g/cm3)	1.0-1.3	1.0-1.3	1.0-1.3
7	viscosity after mix(m Pa·S)			1000～1300	1000～1300	1000～1300
8	mix ratio			100:10	100:10	100:10
9	Operable time（min）			＜30	＜30	＜30
10	60℃ heating curing time（min）			30	30	30
11	Room temperature curing time（hr）			24	24	24
12	After curing	hardness（shore A,24hr）		30～50	30～50	30～50
13		tensile strength（MPa）		≥0.8	≥0.8	≥0.8
14		volume resistivity（Ω·cm）		≥1.0×10¹⁵	≥1.0×10¹⁵	≥1.0×10¹⁵
15		dielectric strength（kv/mm）		≥ 20	≥ 20	≥ 20
16		bake（80℃ 144h）		Not yellow	-	-

Kind remind: The above properties were measured at 25 ℃ and 55% RH for 7 days. The parameters provided in this data may vary depending on the environmental, temperature and humidity conditions;

Product details

organic silicon electronic potting sealant SD9501-8

Silicone electronic potting

SD9501 integrated silicone electronic potting Compound, high elasticity, high transparent Electronic components potting glue.

organic silicon electronic potting sealant SD9501-9

White/black viscous liquid

Good fluidity, good elasticity, excellent resistance to high and low temperature, excellent electrical performance.

organic silicon electronic potting sealant SD9501-10

Green environmental protection

Non-toxic and non-corrosive,The products fully comply with the requirements of EU RoHS standard

organic silicon electronic potting sealant SD9501-11

Iron bottle packaging

packing specification: 20kg/set ,component A/10kg .component B/10kg.

Use instructions

Caution

1. Mix the two components according to the weight ratio of A:B=1:1 and stir well, then remove air bubbles (vacuum or static) and then fill it up. Note: must stir evenly, otherwise affect the properties of solidified compounds; should be used within the applicable period of the sealant.
2. About mixing; After mixing component A and component B, manual or mechanical mixing can be adopted. When mixing, high temperature should be avoided because of high speed and long time agitation, so as to avoid shortening operation time and speeding up solidification, in case operate time is not enough. The surface of the product must be cleaned before it is sealed.
3. The work site and working environment must maintain the air circulation, in case the concentration is too high after the chemical liquid volatilize in the air, causes the staff to be sick (respiratory tract and skin irritation etc.).
4. The surface in contact with the compound must be cleaned. It is forbidden to mix the compound with organic compounds containing nitrogen, phosphorus, sulfur and heavy metal ions containing Sn,Ph,Hg, Bi, As , in case affect the curing of the compound.

Packaging and preservation

20kg/ set (component A 10kg and B 10kg), transported as non-dangerous goods, stored in a cool (room temperature) dry place, guarantee period is 6 months.

Company Features
1. Huizhou SANDAO New Material Co., Ltd's sales volume keeps rising year by year.
2. Huizhou SANDAO New Material Co., Ltd constantly researches and develops a large number of novelty, quality, and perfect Two-component addition-type potting adhesive TDS products.
3. Huizhou SANDAO New Material Co., Ltd's Two-component addition-type potting adhesive TDS is a symbol of strength and taste. Check it! Huizhou SANDAO New Material Co., Ltd is a company who aims to be the one of the most popular Two-component addition-type potting adhesive TDS enterprise. Check it! Huizhou SANDAO New Material Co., Ltd aims to serve every customer well. Check it!

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Relevant Articles

Five important factors affecting thermal conductivity of silicone grease

1. Types and characteristics of polymer matrix materials The higher thermal conductivity of matrix materials, the better the dispersion of filler in matrix, the better the combination of matrix and filler, and the better thermal conductivity of thermal composites.2. Type of filler The higher thermal conductivity of the filler, the better thermal conductivity of the composites.3. Shape of filler the sequence of thermal conduction pathways are fibrous , flake and granular, the easier the filler is to form thermal conduction pathways, the better thermal conductivity.4. Content of fillerThe distribution of filler in polymer determines the thermal conductivity of composite. When the content of filler is small, the effect of heat conduction is not obvious. When there is too much filler, the mechanical properties of the composites will be greatly affected. When the content of the filler increases to a certain value, the interaction between the filler forms a network or chain chain in the system. When the direction of the chain is consistent with the direction of heat flow, the thermal conductivity is best. Therefore, there is a critical value of the quantity of heat conducting filler.5. Bonding characteristics of filler and matrix material interface .The higher the degree of binding between the filler and matrix, the better the thermal conductivity. The suitable coupling agent is used for surface treatment of the filler, and the thermal conductivity can be increased by 10%-20%.

How to remove organic silica gel ?

First,it’s very easy to remove and clean when the silicone rubber uncured. No matter it’s in human body, utensils or clothing,just wash it by water. Second,it’s very difficult to remove organic silica gel after curing, If solidified gel is cohere to glass, ceramics, metals and so on, you can clean it with solvents such as xylene and acetone. If you don't know these two kinds of substances. Banana water can be considered, because banana water contains these two kinds of substances, If there is less organic glue attached to objects such as glass, you can also try scraping it off with a scraper. If cohere to cloth, try to use brush, if not ok, choose banana water. Third, it is easy to deal with if silicone rubber cohere on hands. Organic silicone will not stick to the hand after cured, so we can remove it by rub hands.

Solution to bubbles in epoxy resin potting compound

During the filling process, the problem of bubbles in the capacitor after filling is often encountered, which may be due to the following reasons:1. Bubbles come when mixing and pottingIt is very easy to bring air into the glue because of the large viscosity of glue or wrong stirring. If the viscosity of glue is large, the bubble is difficult to eliminate. If the glue viscosity is small, the glue solidifies slowly, the bubble will slowly float to the surface to eliminate automatically. In order to eliminate the bubbles in the process of glue filling, the bubbles can be eliminated by vacuuming, heating to reduce viscosity, adding diluent to reduce viscosity or adding defoamer. Pls choose the best way for yourself. 2. Bubbles come during curingThere are also several reasons for the formation of bubbles in the curing process: the curing speed is too fast, the exothermic temperature is high, the shrinkage of the glue is large, too much plasticizer and solvent in the glue.these are easy to produce bubbles in the curing process. Epoxy resin sealant is widely used in electronic products such as transformers, capacitors and so on. Its main functions are moisture-proof, water-proof, oil-proof and dust-proof. It also has excellent resistance to moisture, heat and aging. By virtue of these advantages, it occupies a considerable advantage in the field of electronic encapsulation.

High heat conductively grease features

As heat conducting material, silica gel can quickly absorb heat and give off heat.The higher the thermal conductivity of the silicone is, the more effective it is in transmitting heat from your processor to the radiator.Thus reducing the technical difference between the radiators and the radiating structure components which requires the effect of shock absorption, installation, testing, and the convenience of repeated use.

Organic silicon electronic potting sealant SD9501

our product

Feature

Application

product Performance

Product details

Use instructions

Packaging and preservation