The silicone sealant is used for bonding and positioning of electronic components on an electronic circuit board, and is shockproof, moisture-proof and sealed, and high-temperature adhesive seal of metal plane.
Power Adapter
Semiconductor material bonding
Ceramic bonding
Electronic circuit board
Glass bonding
Metal bonding
| Type | SD909QT | SD909BT | SD909W |
| Color | Colorless transparent semi-fluid | Black semi-fluid | White semi-fluid |
| Density(g/cm3) | 1.0～1.05 | 1.0～1.05 | 1.0～1.05 |
| Tack-free time（25℃,min） | 3～10 | 3～10 | 3～10 |
| Tensile strength （MPa） | ≥0.8 | ≥0.8 | ≥0.8 |
| Elongation （%） | ≥400 | ≥400 | ≥400 |
| Shear strength（MPa） | ≥0.6 | ≥0.6 | ≥0.6 |
| Hardness(shore A) | 8～15 | 8～15 | 8～15 |
| Dielectric constant（@60Hz） | 2.8 | 2.8 | 2.8 |
| Dielectric strength（kV/mm） | ≥22 | ≥22 | ≥22 |
| Volume Resistance（Ω.cm） | 2.0×1015 | 2.0×1015 | 2.0×1015 |
The surface of the substrate must be degreased and dried, and corona treatment can improve the bonding effect(thickness not exceeding 6 mm).
The silicone adhesive sealant has a surface cure time of about 20 minutes and is fully cured after 24 hours.
Notes:
1.When the relative temperature is higher than 30%, the curing will accelerate.
2.Keep thermal paste out of reach of children.
3.Manufacturer shall not be liable to the buyer or any third party for injury, loss or damage directly or indirectly resulting from the use of, or inability to use, the product. Recommendations or statements other than those contained in a written agreement signed by an officer of the manufacturer shall not be binding by the manufacturer. This product has not been tested for, and is therefore not recommended for, uses for which prolonged contact with mucous membranes, abraded skin, or blood is intended; or for uses which implantation within the human body is intended.
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