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hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating

hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating

Hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating

Model number
SD6341
MOQ
1pcs
Color
White/black liquid
Package
1.25kg/ set
Main characteristic
Two-component Ratio is 4:1, no need of vacuum defoaming
Main application
silicon steel materials, roller core materials, coil windings,etc.
Lead time
within a week after payment
Price
Get Latest Price
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Quantity Needed:
Pieces
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Product Comparison
SANDAO New Material carries out strict quality monitoring and cost control on each production link of ms adhesive, from raw material purchase, production and processing and finished product delivery to packaging and transportation. This effectively ensures the product has better quality and more favorable price than other products in the industry.Compared with other products in the same category, SANDAO New Material's ms adhesive has the following advantages.
Company Advantages
1. The production of SANDAO Two-component addition-type potting adhesive TDS is organized according to the most advanced production practice of lean production.
2. The product has passed all relative certificates of quality.
3. Having been tested and modified for multiple times, the product is at its best quality.
4. With its irreplaceable market demand, it will be recognized by customers for a long time.
5. This product has garnered significant attention and praise in the industry.

our product

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hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-1
Epoxy resin potting sealant SD6341
Epoxy resin potting sealant SD6341 is a two-component electronic material used for general electronic component sealing and circuit board sealing. It can be cured at room temperature or heated, and the cost is lower. Temperature during curing is low and the highest exothermic temperature is less than 50 ℃. Good surface gloss, low shrinkage, excellent moisture resistance and insulation after curing.

Application

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Epoxy resin pouring sealant is widely used in silicon steel materials, roller core materials, coil windings, capacitor bushing and other important radiating and high temperature resistance electronic appliances, such as transformers, motors, radiators, sensors, electromagnets, PCB plates, solenoid valves, air conditioners, power module, electromagnetic clutch, automobile parts, etc.

hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-2

air conditioning

hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-3

heat sink

hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-4

Induction cooker bonding


hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-5

PCB board bonding

hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-6

Power module

hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-7

Motor bonding



product Performance

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Characteristics
  • ◪  Two-component 4:1 ratio, 100% solidification, no solvent, no pollution, no toxicity.

  • ◪  Good weather resistance, water resistance, oil resistance, acid resistance, high temperature resistance, insulation, flame retardant, cracking resistance and so on.

  • ◪  Can be cured at room temperature and heating, high bonding strength. Stable performance, good toughness and filling after curing, excellent physical, mechanical and insulation properties.

  •   It has low viscosity after mixing, no need of vacuum defoaming at room temperature, and long operating time, so it’s a kind of ideal pouring glue.

  •   For some larger parts of the pouring and sealing, can be one-time molding, more operational advantages.

  •   Achieve actually measured high thermal conductivity: 0.8w/m.k

General performance
ItemConditionPart APart BMix liquid
AppearanceVisualWhite/black Viscous liquidTransparent / brown liquidWhite/black liquid
Density25℃,g/cm31.64~1.651.11~1.131.59~1.61
Viscosity25℃, mpa.s12000~1300040~120800~1000

Usage: 1.Mixing: mix part A and part B at 4:1 ratio by weight, potting after stir well. The operating time after mixing is 60 minutes at 25 ℃.
2.Solidification: at 25 ℃, it will harden at 6 for 8 hours, and at 80 ℃ for 1 hour. It can be assembled after hardening. Tests typically take place after 24 hours of curing.

Notes:This data is measured by the technicians in the laboratory, which has certain reference value for the users. However, because the usage methods and conditions of each user are different, it is suggested that the users should find out the best technology and method according to their own conditions.


Feature after curing
Itemcondition/unitTest result
HardnessShore-D>80
Volume resistivity25℃,Ω.cm2.8*1015
Breakdown voltage25℃,kv/mm>30
Dielectric constant25℃,1MHZ3.1±0.1
Dielectric loss tangent25℃,1MHZ<0.01
Shear temperature rangeMpa>10
Operating temperature range-40~150
Curing shrinkage%<0.5

Attention: 1, This kind of products are not dangerous goods, according to the general chemical storage and transportation, the storage period is 1 year.
2, A component should be stirred properly before use (as there will be precipitation after long period of time, it does not affect the performance after stir well,); after accurate weighing of component A and component B, please stir well and then use it.
3, The mixing amount of glue should not be too large, otherwise, the operating time will be shortened which lead to waste if cannot use out timely.

Notes:The above performance data are typical data of the product at humidity 70 ℃, temperature 25 ℃,for customer's reference only. Customers are kindly requested to use the measured data.

Product details

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hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-8
Epoxy resin potting and sealing adhesive
SD6341 epoxy potting compound is a two-component electronic material used for Potting of general electronic components And circuit board sealing.
hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-9
White/black viscous liquid
It can be cured at room temperature, and can be Cured by heating. After curing, the surface gloss Is good, the shrinkage rate is low, and the Moisture resistance and insulation Performance are excellent.
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Green environmental protection
Non-toxic, non-corrosive, free of harmful Substances.
hot-sale Two-component addition-type potting adhesive TDS heatconductive vendor for electroplating-11
Plastic bottle packaging
packaging specifications: 1.25kg/ set.

Company Features
1. Huizhou SANDAO New Material Co., Ltd is an enterprise integrating the R&D, manufacture, and sales of ge rtv silicone. Our advantages in the filed are market recognized.
2. Located in the Mainland, China, our factory is strategically near to the airport and ports. This couldn't be easier for our customers to visit our factory or for our products to be delivered.
3. Looking into the future, Huizhou SANDAO New Material Co., Ltd will continue to uphold the philosophy of ge rtv silicone. Ask online! To achieve a breakthrough in ge rtv silicone, it is essential for SANDAO to have determination and preservance. Ask online! We will always providing high quality and best service for our Two-component addition-type potting adhesive TDS. Ask online!
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