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Wafer backgrinding tapes totally shield the wafer surface throughout backgrinding and likewise forestall wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly utilized in processing semiconductor wafers created from materials such as silicon or glass. Its powerful adhesive power keeps wafers in place when grinding and slicing. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive power, making tape peeling or die decide up simple.