◪ Resistance to high and low temperature -60~260℃
◪ Sandao organic silicon electronic pouring sealant with the advantages of automatic leveling, automatic remove air bubbles, high viscosity, high temperature resistance, moisture proof and waterproof insulation, easy rework, it can used as adhesive, sealing, waterproof, moisture-proof, mildew proof, dustproof, filling seal, shock absorption, aging resistance and so on.
This potting sealant is fit for electrical and electronic components which required for waterproof and insulation, used for adhesive and sealing LED junction box, wind power motor, PCB substrate, etc., as well as various AC/DC power supply modules, control modules, automotive HID stabilizers, lights and various power control modules,etc.
DC power module bonding
LED junction box bonding
Wind energy motor bonding
Power module
PCB board bonding
Lamp part Bonding
| No. | Item | Standard | Standard | Standard | ||
| 1 | Before curing | Part A | appearance | transparent | black | white |
| 2 | viscosity(m Pa·S) | 800～1000 | 800～1000 | 800～1000 | ||
| 3 | density(g/cm3) | 0.95～1.0 | 0.95～1.0 | 0.95～1.0 | ||
| 4 | Part B | appearance | transparent | transparent | transparent | |
| 5 | viscosity (m Pa·S) | 50-150 | 50-150 | 50-150 | ||
| 6 | density (g/cm3) | 1.0-1.3 | 1.0-1.3 | 1.0-1.3 | ||
| 7 | viscosity after mix(m Pa·S) | 1000～1300 | 1000～1300 | 1000～1300 | ||
| 8 | mix ratio | 100:10 | 100:10 | 100:10 | ||
| 9 | Operable time（min） | ＜30 | ＜30 | ＜30 | ||
| 10 | 60℃ heating curing time（min） | 30 | 30 | 30 | ||
| 11 | Room temperature curing time（hr） | 24 | 24 | 24 | ||
| 12 | After curing | hardness（shore A,24hr） | 30～50 | 30～50 | 30～50 | |
| 13 | tensile strength（MPa） | ≥0.8 | ≥0.8 | ≥0.8 | ||
| 14 | volume resistivity（Ω·cm） | ≥1.0×1015 | ≥1.0×1015 | ≥1.0×1015 | ||
| 15 | dielectric strength（kv/mm） | ≥ 20 | ≥ 20 | ≥ 20 | ||
| 16 | bake（80℃ 144h） | Not yellow | - | - | ||
Kind remind: The above properties were measured at 25 ℃ and 55% RH for 7 days. The parameters provided in this data may vary depending on the environmental, temperature and humidity conditions;
1. Mix the two components according to the weight ratio of A:B=1:1 and stir well, then remove air bubbles (vacuum or static) and then fill it up. Note: must stir evenly, otherwise affect the properties of solidified compounds; should be used within the applicable period of the sealant.
2. About mixing; After mixing component A and component B, manual or mechanical mixing can be adopted. When mixing, high temperature should be avoided because of high speed and long time agitation, so as to avoid shortening operation time and speeding up solidification, in case operate time is not enough. The surface of the product must be cleaned before it is sealed.
3. The work site and working environment must maintain the air circulation, in case the concentration is too high after the chemical liquid volatilize in the air, causes the staff to be sick (respiratory tract and skin irritation etc.).
4. The surface in contact with the compound must be cleaned. It is forbidden to mix the compound with organic compounds containing nitrogen, phosphorus, sulfur and heavy metal ions containing Sn,Ph,Hg, Bi, As , in case affect the curing of the compound.
20kg/ set (component A 10kg and B 10kg), transported as non-dangerous goods, stored in a cool (room temperature) dry place, guarantee period is 6 months.
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