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awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts

Awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts

Model number
SD6341
MOQ
1pcs
Color
White/black liquid
Package
1.25kg/ set
Main characteristic
Two-component Ratio is 4:1, no need of vacuum defoaming
Main application
silicon steel materials, roller core materials, coil windings,etc.
Lead time
within a week after payment
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Company Advantages
1. SANDAO ge rtv silicone must be tested with regard to different aspects, including flammability testing, moisture resistance testing, antibacterial testing, and stability testing. It is resistant to high temperature and low-temperature alternation
2. Huizhou SANDAO New Material Co., Ltd has a sound management system to ensure product quality and the interests of consumers. It is an indispensable important insulating material for the electronics industry
3. The product has good structural stability. It has gone through heat treatment, which makes it retain its shape even it is imposed with pressure. The product features good extrusion properties
4. It is friendly to the environment. It will not generate pollution such as VOC, lead, or nickel substances on the earth when it is disposed of. It has excellent electrical insulation performance
5. This product is not likely to be out of shape. It is made of high-quality fabrics that feature excellent fiber strength, which enables it to withstand repeated stretch. Its quality directly benefits the service life of the products that use it

our product

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awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-1
Epoxy resin potting sealant SD6341
Epoxy resin potting sealant SD6341 is a two-component electronic material used for general electronic component sealing and circuit board sealing. It can be cured at room temperature or heated, and the cost is lower. Temperature during curing is low and the highest exothermic temperature is less than 50 ℃. Good surface gloss, low shrinkage, excellent moisture resistance and insulation after curing.

Application

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Epoxy resin pouring sealant is widely used in silicon steel materials, roller core materials, coil windings, capacitor bushing and other important radiating and high temperature resistance electronic appliances, such as transformers, motors, radiators, sensors, electromagnets, PCB plates, solenoid valves, air conditioners, power module, electromagnetic clutch, automobile parts, etc.

awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-2

air conditioning

awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-3

heat sink

awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-4

Induction cooker bonding


awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-5

PCB board bonding

awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-6

Power module

awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-7

Motor bonding



product Performance

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Characteristics
  • ◪  Two-component 4:1 ratio, 100% solidification, no solvent, no pollution, no toxicity.

  • ◪  Good weather resistance, water resistance, oil resistance, acid resistance, high temperature resistance, insulation, flame retardant, cracking resistance and so on.

  • ◪  Can be cured at room temperature and heating, high bonding strength. Stable performance, good toughness and filling after curing, excellent physical, mechanical and insulation properties.

  •   It has low viscosity after mixing, no need of vacuum defoaming at room temperature, and long operating time, so it’s a kind of ideal pouring glue.

  •   For some larger parts of the pouring and sealing, can be one-time molding, more operational advantages.

  •   Achieve actually measured high thermal conductivity: 0.8w/m.k

General performance
ItemConditionPart APart BMix liquid
AppearanceVisualWhite/black Viscous liquidTransparent / brown liquidWhite/black liquid
Density25℃,g/cm31.64~1.651.11~1.131.59~1.61
Viscosity25℃, mpa.s12000~1300040~120800~1000

Usage: 1.Mixing: mix part A and part B at 4:1 ratio by weight, potting after stir well. The operating time after mixing is 60 minutes at 25 ℃.
2.Solidification: at 25 ℃, it will harden at 6 for 8 hours, and at 80 ℃ for 1 hour. It can be assembled after hardening. Tests typically take place after 24 hours of curing.

Notes:This data is measured by the technicians in the laboratory, which has certain reference value for the users. However, because the usage methods and conditions of each user are different, it is suggested that the users should find out the best technology and method according to their own conditions.


Feature after curing
Itemcondition/unitTest result
HardnessShore-D>80
Volume resistivity25℃,Ω.cm2.8*1015
Breakdown voltage25℃,kv/mm>30
Dielectric constant25℃,1MHZ3.1±0.1
Dielectric loss tangent25℃,1MHZ<0.01
Shear temperature rangeMpa>10
Operating temperature range-40~150
Curing shrinkage%<0.5

Attention: 1, This kind of products are not dangerous goods, according to the general chemical storage and transportation, the storage period is 1 year.
2, A component should be stirred properly before use (as there will be precipitation after long period of time, it does not affect the performance after stir well,); after accurate weighing of component A and component B, please stir well and then use it.
3, The mixing amount of glue should not be too large, otherwise, the operating time will be shortened which lead to waste if cannot use out timely.

Notes:The above performance data are typical data of the product at humidity 70 ℃, temperature 25 ℃,for customer's reference only. Customers are kindly requested to use the measured data.

Product details

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awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-8
Epoxy resin potting and sealing adhesive
SD6341 epoxy potting compound is a two-component electronic material used for Potting of general electronic components And circuit board sealing.
awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-9
White/black viscous liquid
It can be cured at room temperature, and can be Cured by heating. After curing, the surface gloss Is good, the shrinkage rate is low, and the Moisture resistance and insulation Performance are excellent.
awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-10
Green environmental protection
Non-toxic, non-corrosive, free of harmful Substances.
awesome Two-component addition-type potting adhesive TDS silicon  manufacturer for electronic parts-11
Plastic bottle packaging
packaging specifications: 1.25kg/ set.

Company Features
1. At present, most of the Two-component addition-type potting adhesive TDS series produced by us are original products in China.
2. We are a high quality professional manufacturer. Inquiry!
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